Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446459 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Seung Wook Yoon, Yaojian Lin | 2019-10-15 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2019-01-15 |