Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515828 | Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu | 2019-12-24 |
| 10475779 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Kang Chen | 2019-11-12 |
| 10446459 | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) | Thomas Strothmann, Yaojian Lin | 2019-10-15 |
| 10213396 | Patch to enhance locally fat metabolism, using thermoplastic elastomer gel composition including capsaicin | Kyu Hak Cho | 2019-02-26 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz +1 more | 2019-01-15 |