Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515828 | Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Seung Wook Yoon, Pandi C. Marimuthu | 2019-12-24 |
| 10181423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Seung Wook Yoon +1 more | 2019-01-15 |