Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453785 | Semiconductor device and method of forming double-sided fan-out wafer level package | Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh | 2019-10-22 |
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Yang Tan | 2019-10-15 |
| 10297556 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Kang Chen, Seng Guan Chow, Yaojian Lin | 2019-05-21 |