Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Yaojian Lin, Jose Alvin Caparas, Yang Tan | 2019-10-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446523 | Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Yaojian Lin, Jose Alvin Caparas, Yang Tan | 2019-10-15 |