Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354934 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2019-07-16 |
| 10170385 | Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP | Yaojian Lin, Kang Chen, Yu Gu | 2019-01-01 |