Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10471698 | Computational model and three-dimensional (3D) printing methods | Keshava A. Prasad, David H. Donovan, Krzysztof Nauka, Ali Emamjomeh | 2019-11-12 |
| 10354934 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Rui Huang, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2019-07-16 |
| 10179468 | Drying media | Gary Tarver, Jayanta C. Panditaratne, Jason Hower, James Kearns | 2019-01-15 |