Issued Patents 2019
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10498379 | Wireless interconnects on flexible cables between computing platforms | Richard J. Dischler | 2019-12-03 |
| 10484120 | Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle | Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Johanna M. Swan, Erich N. Ewy | 2019-11-19 |
| 10477596 | Blade computing system with wireless communication between blades within a blade enclosure | Rahul Khanna | 2019-11-12 |
| 10476545 | Communication between integrated circuit packages using a millimeter-wave wireless radio fabric | Adel A. Elsherbini, Sasha N. Oster, Brandon M. Rawlings, Georgios Dogiamis | 2019-11-12 |
| 10468737 | Assembly and manufacturing friendly waveguide launchers | Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini | 2019-11-05 |
| 10461388 | Millimeter wave fabric network over dielectric waveguides | Georgios Dogiamis, Sasha N. Oster | 2019-10-29 |
| 10452571 | Microelectronic package communication using radio interfaces connected through waveguides | Sasha N. Oster, Adel A. Elsherbini, Georgios Dogiamis, Brandon M. Rawlings | 2019-10-22 |
| 10453804 | Radio die package with backside conductive plate | Thorsten Meyer | 2019-10-22 |
| 10439671 | Microelectronic devices designed with high frequency communication modules having steerable beamforming capability | Georgios Dogiamis, Vijay K. Nair | 2019-10-08 |
| 10432167 | Piezoelectric package-integrated crystal devices | Adel A. Elsherbini, Feras Eid, Baris Bicen, Vijay K. Nair, Johanna M. Swan +2 more | 2019-10-01 |
| 10410983 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package | Georgios Dogiamis, Vijay K. Nair | 2019-09-10 |
| 10404499 | Dispersion compensation for waveguide communication channels | Georgios Dogiamis, Emanuel Cohen, Sasha N. Oster | 2019-09-03 |
| 10327268 | Microelectronic package with wireless interconnect | Adel A. Elsherbini, Emanuel Cohen | 2019-06-18 |
| 10326211 | Distributed on-package millimeter-wave radio | Adel A. Elsherbini | 2019-06-18 |
| 10304804 | System on package architecture including structures on die back side | Fay Hua, Johanna M. Swan | 2019-05-28 |
| 10304686 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2019-05-28 |
| 10291283 | Tunable radio frequency systems using piezoelectric package-integrated switching devices | Feras Eid, Adel A. Elsherbini, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan +1 more | 2019-05-14 |
| 10277322 | Channelization for dispersion limited waveguide communication channels | Georgios Dogiamis, Sasha N. Oster, Emanuel Cohen | 2019-04-30 |
| 10263346 | Single-package phased array module with interleaved sub-arrays | Adel A. Elsherbini | 2019-04-16 |
| 10263312 | Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards | Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff +3 more | 2019-04-16 |
| 10256521 | Waveguide connector with slot launcher | Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more | 2019-04-09 |
| 10256286 | Integrated inductor for integrated circuit devices | Andreas Duevel, Valluri Rao, Uwe Zillmann | 2019-04-09 |
| 10249925 | Dielectric waveguide bundle including a supporting feature for connecting first and second server boards | Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff +3 more | 2019-04-02 |
| 10211970 | Millimeter wave CMOS engines for waveguide fabrics | Georgios Dogiamis, Sasha N. Oster | 2019-02-19 |