Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10455308 | Die with integrated microphone device using through-silicon vias (TSVs) | Kevin J. Lee, Ruchir Saraswat, Valluri Rao, Tor Lund-Larsen, Nicholas P. Cowley | 2019-10-22 |
| 10403511 | Backside redistribution layer patch antenna | Ruchir Saraswat, Nicholas P. Cowley | 2019-09-03 |
| 10290598 | Method and apparatus for forming backside die planar devices and saw filter | Kevin J. Lee, Ruchir Saraswat, Nicholas P. Cowley, Richard J. Goldman | 2019-05-14 |
| 10256286 | Integrated inductor for integrated circuit devices | Andreas Duevel, Telesphor Kamgaing, Valluri Rao | 2019-04-09 |