Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10455308 | Die with integrated microphone device using through-silicon vias (TSVs) | Ruchir Saraswat, Uwe Zillmann, Valluri Rao, Tor Lund-Larsen, Nicholas P. Cowley | 2019-10-22 |
| 10290598 | Method and apparatus for forming backside die planar devices and saw filter | Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Richard J. Goldman | 2019-05-14 |
| 10224309 | Integrated circuit die having backside passive components and methods associated therewith | — | 2019-03-05 |