Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510667 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Mitul Modi | 2019-12-17 |
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Yu Zhang, Mathew J. Manusharow, Mohiuddin M. Mazumder | 2019-10-22 |
| 10416378 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Zhichao Zhang, Robert L. Sankman | 2019-09-17 |
| 10396022 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2019-08-27 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Zhiguo Qian, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more | 2019-08-27 |
| 10375832 | Method of forming an interference shield on a substrate | Digvijay A. Raorane, Daniel N. Sobieski, Drew W. Delaney | 2019-08-06 |
| 10317932 | Capacitive structures for crosstalk reduction | Zhichao Zhang, Xiang Li, Zhiguo Qian, Tolga Memioglu | 2019-06-11 |
| 10303225 | Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby | Zhichao Zhang, Cemil Geyik, Guneet Kaur | 2019-05-28 |
| 10283453 | Interconnect routing configurations and associated techniques | Zhiguo Qian, Dae-Woo Kim | 2019-05-07 |
| 10205292 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley +3 more | 2019-02-12 |