Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373806 | Apparatus and method for deposition and etch in gap fill | Akhil Singhal, Patrick A. Van Cleemput, Martin E. Freeborn | 2019-08-06 |
| 10361076 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Hu Kang, Shankar Swaminathan, Jun Qian, Wanki Kim, Dennis M. Hausmann +1 more | 2019-07-23 |
| 10351955 | Semiconductor substrate processing apparatus including uniformity baffles | Arun Keshavamurthy, David Cohen | 2019-07-16 |
| 10316409 | Radical source design for remote plasma atomic layer deposition | — | 2019-06-11 |
| 10224235 | Systems and methods for creating airgap seals using atomic layer deposition and high density plasma chemical vapor deposition | Jason D. Park, Hsiang-Yun Lee, Purushottam Kumar | 2019-03-05 |
| 10214816 | PECVD apparatus for in-situ deposition of film stacks | Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Dong Niu, Keith Fox +5 more | 2019-02-26 |
| 10192759 | Image reversal with AHM gap fill for multiple patterning | Nader Shamma, Sirish Reddy, Chunhai Ji | 2019-01-29 |