Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10358717 | Method for depositing high deposition rate, thick tetraethyl orthosilicate film with low compressive stress, high film stability and low shrinkage | Jonathan Church | 2019-07-23 |
| 10214816 | PECVD apparatus for in-situ deposition of film stacks | Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Dong Niu, John B. Alexy +5 more | 2019-02-26 |