Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497694 | Power semiconductor devices and a method for forming a power semiconductor device | Guenther Kolmeder | 2019-12-03 |
| 10497634 | Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound | Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert +1 more | 2019-12-03 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2019-10-29 |
| 10403556 | Semiconductor device including a heat sink structure | Johannes Georg Laven, Peter Irsigler, Guenther Ruhl, Hans-Joachim Schulze, Markus Zundel | 2019-09-03 |
| 10396015 | Die attach methods and semiconductor devices manufactured based on such methods | Benjamin Reichert, Chen Wen Lee, Giovanni Ragasa Garbin, Peter Strobel | 2019-08-27 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2019-08-27 |
| 10297564 | Semiconductor die attach system and method | Georg Meyer-Berg | 2019-05-21 |
| 10177112 | Attaching chip attach medium to already encapsulated electronic chip | Edward Fuergut, Georg Meyer-Berg | 2019-01-08 |