Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483133 | Method for fabricating a semiconductor chip panel | Daniel Porwol | 2019-11-19 |
| 10435292 | Method for producing a semiconductor module | Claus Waechter, Bernd Goller, Michael Ledutke, Dominic Maier | 2019-10-08 |
| 10418313 | Electronic module comprising a plurality of encapsulation layers and a method for producing it | Martin Gruber, Juergen Hoegerl | 2019-09-17 |
| 10373895 | Semiconductor device having die pads with exposed surfaces | Martin Gruber, Wolfgang Scholz, Ralf Otremba | 2019-08-06 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Teck Sim Lee +5 more | 2019-08-06 |
| 10361138 | Method for manufacturing an arrangement including a chip carrier notch | Michael Ledutke | 2019-07-23 |
| 10347554 | Spatially selective roughening of encapsulant to promote adhesion with functional structure | Norbert Joson Santos, Sanjay Kumar Murugan | 2019-07-09 |
| 10256119 | Method of manufacturing a semiconductor power package | Thomas Basler, Christian Kasztelan, Ralf Otremba | 2019-04-09 |
| 10177112 | Attaching chip attach medium to already encapsulated electronic chip | Joachim Mahler, Georg Meyer-Berg | 2019-01-08 |