Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522433 | Laminate package of chip on carrier and in cavity | Horst Theuss, Gottfried Beer | 2019-12-31 |
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Andreas Grassmann, Wolfram Hable, Ivan Nikitin, Achim Strass | 2019-10-29 |
| 10453771 | Package with roughened encapsulated surface for promoting adhesion | Andreas Grassmann, Kiyoung Jang, Ivan Nikitin | 2019-10-22 |
| 10418313 | Electronic module comprising a plurality of encapsulation layers and a method for producing it | Edward Fuergut, Martin Gruber | 2019-09-17 |
| 10373890 | Cooling techniques for semiconductor package | Andreas Grassmann | 2019-08-06 |
| 10304751 | Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe | Andreas Grassmann | 2019-05-28 |
| 10242969 | Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same | Olaf Hohlfeld, Angela Kessler, Magdalena Hoier | 2019-03-26 |
| 10211133 | Package with interconnections having different melting temperatures | Andreas Grassmann, Angela Kessler, Ivan Nikitin | 2019-02-19 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Gottfried Beer, Magdalena Hoier, Georg Meyer-Berg | 2019-02-19 |