Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242969 | Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same | Olaf Hohlfeld, Juergen Hoegerl, Angela Kessler | 2019-03-26 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Georg Meyer-Berg | 2019-02-19 |