Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522447 | Chip package and a wafer level package | — | 2019-12-31 |
| 10297564 | Semiconductor die attach system and method | Joachim Mahler | 2019-05-21 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Gottfried Beer, Magdalena Hoier | 2019-02-19 |
| 10177112 | Attaching chip attach medium to already encapsulated electronic chip | Joachim Mahler, Edward Fuergut | 2019-01-08 |