Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522433 | Laminate package of chip on carrier and in cavity | Juergen Hoegerl, Horst Theuss | 2019-12-31 |
| 10438926 | Method for fabricating a semiconductor and semiconductor package | Irmgard Escher-Poeppel | 2019-10-08 |
| 10295570 | Current sensor device having a sense resistor in a re-distribution layer | Wolfgang Furtner | 2019-05-21 |
| 10241088 | Photo-acoustic gas sensor module having light emitter and detector units | Horst Theuss, Sebastian Beer, Alfons Dehe, Franz Jost, Stefan Kolb +2 more | 2019-03-26 |
| 10211158 | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module | Olaf Hohlfeld, Juergen Hoegerl, Magdalena Hoier, Georg Meyer-Berg | 2019-02-19 |