Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283432 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Wolfram Hable, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2019-05-07 |
| 10242969 | Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same | Olaf Hohlfeld, Juergen Hoegerl, Magdalena Hoier | 2019-03-26 |
| 10211133 | Package with interconnections having different melting temperatures | Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin | 2019-02-19 |