Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Achim Strass | 2019-10-29 |
| 10453771 | Package with roughened encapsulated surface for promoting adhesion | Andreas Grassmann, Juergen Hoegerl, Kiyoung Jang | 2019-10-22 |
| 10211133 | Package with interconnections having different melting temperatures | Andreas Grassmann, Juergen Hoegerl, Angela Kessler | 2019-02-19 |