Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2019-10-29 |
| 10283432 | Molded package with chip carrier comprising brazed electrically conductive layers | Mark Pavier, Angela Kessler, Michael Sielaff, Anton Pugatschow, Charles Rimbert-Riviere +1 more | 2019-05-07 |