Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Wolfram Hable, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2019-10-29 |
| 10453771 | Package with roughened encapsulated surface for promoting adhesion | Juergen Hoegerl, Kiyoung Jang, Ivan Nikitin | 2019-10-22 |
| 10373890 | Cooling techniques for semiconductor package | Juergen Hoegerl | 2019-08-06 |
| 10304751 | Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe | Juergen Hoegerl | 2019-05-28 |
| 10211133 | Package with interconnections having different melting temperatures | Juergen Hoegerl, Angela Kessler, Ivan Nikitin | 2019-02-19 |
| 10199238 | Semiconductor module cooling system | Inpil Yoo | 2019-02-05 |