Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418313 | Electronic module comprising a plurality of encapsulation layers and a method for producing it | Edward Fuergut, Juergen Hoegerl | 2019-09-17 |
| 10373895 | Semiconductor device having die pads with exposed surfaces | Edward Fuergut, Wolfgang Scholz, Ralf Otremba | 2019-08-06 |
| 10229885 | Method of galvanic plating assisted by a current distribution layer | Steffen Jordan | 2019-03-12 |
| 10168391 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Toni Salminen, Stefan Mieslinger +4 more | 2019-01-01 |