Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325837 | Molded semiconductor package with C-wing and gull-wing leads | Cher Hau Danny Koh, Hai Sin Chong, Stefan Machiener, Yong Chern Poh, Khay Chwan Saw | 2019-06-18 |
| 10168391 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Stefan Mieslinger, Markus Dinkel +4 more | 2019-01-01 |