Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325837 | Molded semiconductor package with C-wing and gull-wing leads | Cher Hau Danny Koh, Hai Sin Chong, Stefan Machiener, Yong Chern Poh, Toni Salminen | 2019-06-18 |
KS
Khay Chwan Saw
Overall (2019): #384,450 of 560,194Top 70%
1
Patents 2019