Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Teck Sim Lee, Guenther Lohmann +5 more | 2019-08-06 |
| 10373895 | Semiconductor device having die pads with exposed surfaces | Edward Fuergut, Martin Gruber, Wolfgang Scholz | 2019-08-06 |
| 10290566 | Electronic component | Klaus Schiess, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2019-05-14 |
| 10256119 | Method of manufacturing a semiconductor power package | Thomas Basler, Edward Fuergut, Christian Kasztelan | 2019-04-09 |
| 10229870 | Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress | — | 2019-03-12 |
| 10224912 | Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit package | Josef Hoeglauer, Gerhard Noebauer | 2019-03-05 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess, Lee Shuang Wang +3 more | 2019-02-12 |