Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418319 | Method of manufacturing a semiconductor device | Oliver Haeberlen, Stefan Kramp | 2019-09-17 |
| 10290566 | Electronic component | Ralf Otremba, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2019-05-14 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Lee Shuang Wang +3 more | 2019-02-12 |