Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Uwe Kirchner, Teck Sim Lee, Guenther Lohmann +5 more | 2019-08-06 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess, Lee Shuang Wang +3 more | 2019-02-12 |