Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Guenther Lohmann +5 more | 2019-08-06 |
| 10290567 | Transistor package with three-terminal clip | Rainald Sander, Liu Chen | 2019-05-14 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess +3 more | 2019-02-12 |