Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess +3 more | 2019-02-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Ralf Otremba, Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess +3 more | 2019-02-12 |