Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366924 | Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance | Thorsten Scharf | 2019-07-30 |
| 10229885 | Method of galvanic plating assisted by a current distribution layer | Martin Gruber | 2019-03-12 |
| 10229891 | Chip embedding package with solderable electric contact | Thorsten Scharf, Wolfgang Schober, Thomas Ziegler | 2019-03-12 |