Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366924 | Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance | Steffen Jordan | 2019-07-30 |
| 10325834 | Semiconductor packages and methods of fabrication thereof | Dirk Meinhold, Frank Daeche | 2019-06-18 |
| 10314238 | Block baling press | Ulrich Hesselmann, Stefan Birkhofer | 2019-06-11 |
| 10229891 | Chip embedding package with solderable electric contact | Steffen Jordan, Wolfgang Schober, Thomas Ziegler | 2019-03-12 |