Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229891 | Chip embedding package with solderable electric contact | Thorsten Scharf, Steffen Jordan, Wolfgang Schober | 2019-03-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229891 | Chip embedding package with solderable electric contact | Thorsten Scharf, Steffen Jordan, Wolfgang Schober | 2019-03-12 |