Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483133 | Method for fabricating a semiconductor chip panel | Edward Fuergut | 2019-11-19 |
| 10332814 | Bonded system and a method for adhesively bonding a hygroscopic material | Claus von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz-Xaver Muehlbauer +3 more | 2019-06-25 |