Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10457001 | Method for forming a matrix composite layer and workpiece with a matrix composite layer | Jayaganasan Narayanasamy, Jagen Krishnan, Hong Lim Lee | 2019-10-29 |
| 10431526 | Rivetless lead fastening for a semiconductor package | Kar Meng Ho, Chiew Li Tai, Jia Yi Wong | 2019-10-01 |
| 10347554 | Spatially selective roughening of encapsulant to promote adhesion with functional structure | Norbert Joson Santos, Edward Fuergut | 2019-07-09 |