Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501312 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng | 2019-12-10 |
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Sook Woon Chan, Khar Foong Chung, Chee Hong Fang, Muhammat Sanusi Muhammad +4 more | 2019-11-26 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee, Joachim Mahler +3 more | 2019-08-27 |
| 10396018 | Multi-phase half bridge driver package and methods of manufacture | Chan Lam Cha, Wei Han Koo, Andreas Kucher, Theng Chao Long | 2019-08-27 |
| 10304780 | Device having substrate with conductive pillars | Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko | 2019-05-28 |