Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum +1 more | 2019-10-01 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Joachim Mahler +3 more | 2019-08-27 |