Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Hock Heng Chong, Sook Woon Chan, Chau Fatt Chiang, Khar Foong Chung, Chee Hong Fang +4 more | 2019-11-26 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2019-08-27 |