Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501312 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Chee Yang Ng | 2019-12-10 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |
| 10396007 | Semiconductor package with plateable encapsulant and a method for manufacturing the same | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Joachim Mahler +3 more | 2019-08-27 |
| 10304780 | Device having substrate with conductive pillars | Chau Fatt Chiang, Kok Yau Chua, Chee Yang Ng, Valentyn Solomko | 2019-05-28 |