Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10501312 | Over-under sensor packaging with sensor spaced apart from control chip | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee | 2019-12-10 |
| 10304780 | Device having substrate with conductive pillars | Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Valentyn Solomko | 2019-05-28 |
| 10224260 | Semiconductor package with air gap | — | 2019-03-05 |