Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Hock Heng Chong, Mei Chin Ng, Aileen Manantan Soriano, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |