Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490470 | Semiconductor package and method for fabricating a semiconductor package | Sook Woon Chan, Chau Fatt Chiang, Khar Foong Chung, Chee Hong Fang, Muhammat Sanusi Muhammad +4 more | 2019-11-26 |
| 10431560 | Molded semiconductor package having an optical inspection feature | Swee Kah Lee, Mei Chin Ng, Aileen Manantan Soriano, Fong Mei Lum, Muhammad Muhammat Sanusi +1 more | 2019-10-01 |