Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475743 | Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device | Ravi Keshav Joshi, Michael Fugger, Oliver Humbel, Thomas Laska, Matthias Mueller +6 more | 2019-11-12 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2019-10-29 |
| 10276656 | Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structure | Andre Brockmeier, Francisco Javier Santos Rodriguez, Daniel Schloegl, Hans-Joachim Schulze | 2019-04-30 |