Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497587 | Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials | Rabie Djemour, Stefan Miethaner | 2019-12-03 |
| 10497634 | Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound | Heinrich Koerner, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more | 2019-12-03 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2019-10-29 |