Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2019-10-29 |
| 10297536 | Direct selective adhesion promotor plating | Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang | 2019-05-21 |