Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497634 | Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound | Heinrich Koerner, Michael Bauer, Reimund Engl, Werner Kanert, Joachim Mahler +1 more | 2019-12-03 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2019-10-29 |