Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497801 | Method of manufacturing a semiconductor device having an undulated profile of net doping in a drift zone | Elmar Falck, Andreas Haertl, Manfred Pfaffenlehner, Daniel Schloegl, Hans-Joachim Schulze +2 more | 2019-12-03 |
| 10461056 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2019-10-29 |
| 10276656 | Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structure | Frank Hille, Andre Brockmeier, Daniel Schloegl, Hans-Joachim Schulze | 2019-04-30 |
| 10256097 | Forming a metal contact layer on silicon carbide and semiconductor device with metal contact structure | Ravi Keshav Joshi, Romain Esteve, Roland Rupp, Gerald Unegg | 2019-04-09 |
| 10211325 | Semiconductor device including undulated profile of net doping in a drift zone | Elmar Falck, Andreas Haertl, Manfred Pfaffenlehner, Daniel Schloegl, Hans-Joachim Schulze +2 more | 2019-02-19 |
| 10170497 | Method for manufacturing an electronic device and method for operating an electronic device | Thoralf Kautzsch, Alessia Scire, Steffen Bieselt, Franz Hirler, Anton Mauder +2 more | 2019-01-01 |