| 10290541 |
Barrier layers in trenches and vias |
Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Chih-Chao Yang |
2019-05-14 |
| 10276053 |
Cognitive system to improve athletic performance with motivation from different training styles |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha |
2019-04-30 |
| 10256191 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny |
2019-04-09 |
| 10249532 |
Modulating the microstructure of metallic interconnect structures |
Roger A. Quon, Chih-Chao Yang |
2019-04-02 |
| 10243020 |
Structures and methods for embedded magnetic random access memory (MRAM) fabrication |
Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert |
2019-03-26 |
| 10229967 |
High-density MIM capacitors |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2019-03-12 |
| 10211155 |
Reducing metallic interconnect resistivity through application of mechanical strain |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert |
2019-02-19 |
| 10211151 |
Enhanced self-alignment of vias for asemiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Nicole Saulnier |
2019-02-19 |
| 10204828 |
Enabling low resistance gates and contacts integrated with bilayer dielectrics |
Ruqiang Bao, Benjamin D. Briggs, Lawrence A. Clevenger, Koichi Motoyama, Cornelius Brown Peethala +1 more |
2019-02-12 |
| 10195901 |
Smartwatch blackbox |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha |
2019-02-05 |
| 10192829 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition |
Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini |
2019-01-29 |
| 10170411 |
Airgap protection layer for via alignment |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny |
2019-01-01 |
