Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128116 | Integrated direct dielectric and metal deposition | William T. Lee, Bart J. van Schravendijk, David Charles Smith, Patrick A. Van Cleemput, Ramesh Chandrasekharan | 2018-11-13 |
| 10103058 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2018-10-16 |
| 10087523 | Vapor delivery method and apparatus for solid and liquid precursors | Joshua Collins, Eric H. Lenz | 2018-10-02 |
| 9997405 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2018-06-12 |
| 9978605 | Method of forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba +2 more | 2018-05-22 |
| 9972504 | Atomic layer etching of tungsten for enhanced tungsten deposition fill | Chiukin Steven Lai, Keren Jacobs Kanarik, Samantha Tan, Anand Chandrashekar, Teh-Tien Su +2 more | 2018-05-15 |
| 9953984 | Tungsten for wordline applications | Hanna Bamnolker, Raashina Humayun, Juwen Gao | 2018-04-24 |